Trans Intl has released 256 MB low-profile memory modules for iMacs and the G3 PowerBook series. The new modules raise the maximum amount of RAM from 384 MB to 512 MB. According to Trans Intl:
Trans Intl today announced the availability of a new high density low profile 256 MB SDRAM SO DIMM memory module for Apple Powerbook G3/333-400 Mhz series, these low profile SDRAM SO-DIMMs are also compatible with Apple's earlier Powerbook G3s (Wallstreet) and iMacs [233-333]. Trans Intl memory modules provide broader availability of high-performance memory specially designed for systems based on PowerPC G3 processors running up to 400 megahertz. The new Powerbook G3 series gives users the ultimate combination of desktop memory capacity in a notebook computer.
Maximizing these systems main memory up to 512 Mb with Trans Intl new low profile 256 Mb low profile DIMM enables users to take full advantage of the latest technological innovations in Apple Powerbooks. Digital Video Professionals using Final Cut Pro software, Photoshop Users, Adobe After Effects Users and Adobe Premier Users will all benefit from the power and price/performance that these systems deliver. And with the addition of Trans Intl memory modules they are assured maximum performance.
New PowerBook G3s have two memory expansion slots for main memory expansion. The system can be upgraded with conventional high and low profile 256 Mb and 128 Mb SO-DIMMs available in the channel, up to 384 Mb maximum. With Trans Intl new 256 Mb low profile SDRAM SO-DIMMs the system main memory can be upgraded up to 512 Mb.
Trans Intl 256 Mb low profile DIMM fits in both memory expansion slots (Top and bottom). Two memory expansion sockets imposes a different height limitation on the physical size of the memory expansion boards used to upgrade the main memory of the system. The upper slots allow memory boards up to 2.0 inch height and the lower allows memory boards up to 1.5 inch high or less. Trans Intl. 256 Mb Low profile SO-DIMM is well under 1.5 inch height limitation and can be used universally in the top and bottom slot. This low form factor feature allows user beside having more memory (512 Mb) than possible by conventional board designs, but also gives and opportunity to move this to bottom slot or any other standard application. since this memory module conforms to industry standard height specification.