The chip maker calls the process HiPerMOS7 - HiP7, for short - the technology is essentially a die-shrink, down from Motorolais current 0.18 micron process. HiP7 uses copper interconnects, along with silicon-on-insulator techniques.
The upshot of all this is the ability to build chips that are smaller and whose circuitry operates more efficiently than previous processes made possible. Essentially, that means faster processors that require less power and generate less heat.
The new manufacturing process will not only help the PowerPC chips found in Macs, however. The small size will allow other types of circuits to reside on the same board, such as radio circuitry, paving the way for the use of this technology in Motorolais suffering flagship technology, mobile phones.
Motorola also touted with HiP7is suitability for system-on-a-chip design, but reading between the lines itis clear this is just its way of selling the processi smaller transistor size. Smaller transistors mean more functionality can be built into a given die size. Motorola noted the ability to build in analogue technology and radio frequency circuitry onto the die alongside the digital logic, a nod toward cellphone and wireless networking equipment vendors keen to cut down on the number of chips they use.
Motorola also highlighted HiP7is modular approach to design, primarily to emphasise how the process can be used for a variety of different kinds of chip.
You can read the full article at The Register Web site.