The iPhone 18 Pro could use different modem chips depending on where Apple sells the device, according to details linked to stolen data from Apple manufacturing partner Tata Electronics. The leak suggests that U.S. models will keep Qualcomm hardware for mmWave 5G support, while international models will move to Apple’s in-house C2 modem.
AppleInsider reported that a bill of materials for the U.S. iPhone 18 Pro variant lists several Qualcomm components, including SDX80M, SDR875, QDM8771, QDM8720, PMK75, PMX75, and QET7100A. These parts are tied to mmWave 5G, which American carriers still promote as a premium network feature.
For models sold outside the U.S., the documents reportedly point to Apple’s C2 modem, which would follow the C1 and C1X modems already used in devices such as the iPhone Air, iPhone 17e, and M5 iPad Pro. This suggests Apple will continue reducing its reliance on Qualcomm, even if the company has not fully moved away from Qualcomm hardware yet.
Apple may use two modem setups
The main reason appears to be mmWave support. Apple’s current in-house modems do not support mmWave 5G, and the leaked details suggest the C2 modem may also skip it. Since Verizon and AT&T have invested heavily in mmWave networks, Apple likely wants U.S. iPhone 18 Pro models to keep supporting those bands.
That decision also creates a possible tradeoff for buyers. Apple’s own modems are generally seen as more power efficient, so iPhone 18 Pro models sold outside the U.S. may deliver better battery life than U.S. models that use Qualcomm hardware.
Daring Fireball’s John Gruber also argued that mmWave offers little real-world benefit for many users, since regular 5G and even LTE already feel fast enough for normal phone use. His view adds weight to the idea that Apple’s U.S. modem choice is more about carrier requirements than everyday performance.
Other iPhone 18 Pro details from the leak
The Tata data reportedly includes more than modem information, and some documents also point to changes in the A20 Pro chip and rear camera system.
- The A20 Pro chip, reportedly codenamed Borneo, may use WMCM packaging, which places the processor and memory side by side instead of using Apple’s usual InFO-PoP design.
- This packaging change may give Apple more flexibility with chip configurations and could also affect heat management inside the iPhone 18 Pro.
- The iPhone 18 Pro’s main rear camera may use a new Sony IMX-905 sensor, replacing the IMX-903 used in the iPhone 17 Pro.
- Earlier rumors have also linked the iPhone 18 Pro to a variable aperture camera, which would give users more control over depth and background blur.
These details still come from prototype documents, so Apple can change parts before final production. However, the leak gives a clear look at Apple’s current direction for the iPhone 18 Pro, with Apple’s own modem expanding globally while Qualcomm remains important in the U.S. market.
The iPhone 18 Pro and iPhone 18 Pro Max are expected to launch in fall alongside Apple’s first foldable iPhone.
