Apple Confirms $30 Billion Broadcom Deal to Build 15 Billion+ US Chips

Apple Explores Intel and Samsung to Reduce Reliance on TSMC for Chips

Apple has announced a multiyear partnership with Broadcom to design and produce custom silicon components and wireless technologies in the United States, with the agreement expected to exceed $30 billion. The deal will support the production of more than 15 billion U.S.-made chips and create hundreds of American jobs, making it Apple’s largest commitment under its American Manufacturing Program.

Apple and Broadcom partnership earlier this week, and Apple has now confirmed more details about the scale of the agreement and its U.S. manufacturing plans.

“Apple and Broadcom have a long history together, and this new phase of our partnership further accelerates our commitment to American manufacturing and innovation,” Apple CEO Tim Cook said.

Apple Broadcom Deal Expands U.S. Chip Production

Broadcom will invest $1.5 billion to expand and modernize its manufacturing facility in Fort Collins, Colorado, where it will produce advanced radio frequency components, including FBAR filters, along with wireless connectivity technologies used across Apple products.

The partnership covers custom radio frequency parts, Wi-Fi and Bluetooth connectivity, and other networking chips found across Apple’s lineup. Apple says the deal forms part of its broader plan to invest $600 billion in the U.S. over four years, as it continues to increase domestic manufacturing through its American Manufacturing Program.

Leave a Reply

Your email address will not be published. Required fields are marked *

This site uses Akismet to reduce spam. Learn how your comment data is processed.